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Structure Product name Type Function
Silicon Monolithic Integrated Circuit Low voltage operation wide band 3-outputs video driver with LPF
BH7606GU
Built in 3-output video drivers for Y, PB and PR signal Built in 6dB AMP Built in standby function (0A TYP) Built in LPF (Y : fc=27MHz, PB/PR : fc=15MHz) No output coupling capacitor required Small package 15-Bump WL-CSP(2.26x2.26x1.0[mm]) Radiation resistance is not included in the design.
Absolute Maximum Ratings
Parameter CP_VCC Supply voltage V_VCC Supply voltage
V_VCC to CP_VCC voltage V_GND to CP_GND voltage
Ta=25
Symbol Vcp Vv Vcc Vgg Vin1 Vin2 Pd Tstg Limits 3.55 3.55 -0.3+0.3 0 -0.3~(V_VCC+0.3) (VEE_IN)-0.3 ~(V_VCC+0.3) 920 -55+125 Unit V V V V V W Condition CP_VCC - (CP_GND or V_GND) V_VCC - ( CP_GND or V_GND) V_VCC - CP_VCC V_GND - CP_GND STBY Y_IN, PB_IN, PR_IN
Input voltage 1 Input voltage 2 Power dissipation Storage temperature
In case mounting on a (110mm x 100mm x 1.6mm) grass-epoxy PCB. Reduced by 9.2 mW/C at 25C or higher.
Operating range Ta=25
Parameter CP_VCC Supply voltage V_VCC Supply voltage Operating temperature Symbol Vcpo Vvo Topr Rating. 2.85 ~ 3.45 2.85 ~ 3.45 -40 ~ +85 Unit
REV. A
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Electrical characteristics
Unless otherwise noted, Ta=25CP_VCC=V_VCC=3V
Limits Min. Typ. 70 0 6.0 4.0 -1.5 -1.0 -1.0 -26 -35 -35 -70 150 0 150 Max. 90 2 6.5 1.0 1.0 1.0 -15 -28 -28 -50 200 100 V_VCC 0.45 200 mA A dB Vp-p dB dB dB dB dB dB dB k mV V V k No signal Standby mode Vin=1.0Vpp , f=100kHz THD=1%, f=10kHz Vin=1.0Vpp , f=27M/100kHz Vin=1.0Vpp , f=15M/100kHz Vin=1.0Vpp , f=15M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=4.43MHz Y/PB/PR_INV_GND
Parameter
Symbol
Unit
conditions
ACTIVE Circuit current STANDBY Y/PB/PR_OUT Voltage gain Y/PB/PR_OUT Maximum output level Y_OUT Frequency characteristics 1 PB_OUT Frequency characteristics 1 PR_OUT Frequency characteristics 1 Y_OUT Frequency characteristics 2 PB_OUT Frequency characteristics 2 PR_OUT Frequency characteristics 2 Cross talk Y/PB/PR_IN Input impedance Y/PB/PR_OUT Output DC offset STBY Input voltage H STBY Input voltage L STBY Input impedance
Icc1 Icc2 GV Vomv Gf1Y Gf1PB Gf1PR Gf2Y Gf2PB Gf2PR CT RinV Voff VthH VthL RinST
50 5.5 3.2 -4.5 -3.0 -3.0 100 -100 V_VCC -1.2 0.0 100
Terminated 75
ACTIVE mode STANDBY mode STBYV_GND
Control pin settings Parameter Status
Operational mode
ACTIVE STANDBY
H STANDBY (B3)
L OPEN
REV. A
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Physical dimensions Block diagram
B3 STBY
H606
D3 Y_IN
Stby V_VCC C2
LOT No.
27MHz LPF 6dB
Y_OUT
D2
D4
PB_IN
15MHz LPF 6dB
PB_OUT
D1
C4
PR_IN
15MHz LPF 6dB
PR_OUT
C1
C3
V_GND
A3
CP_GND
NVCC
VEE_IN
B1
B4
CP_VCC
Charge Pump
C_PLUS C_MINUS
VEE_OUT
A1
A4
A2
UNIT: mm
Fig.. Physical dimensionsVCSP85H2
Fig.2. Block diagram
Pin assignment
Symbol A1 A2 A3 A4 B1 B3 B4 Pin name VEE_OUT C_MINUS CP_GND C_PLUS VEE_IN STBY CP_VCC Symbol C1 C2 C3 C4 D1 D2 D3 D4 Pin name PR_OUT V_VCC V_GND PR_IN PB_OUT Y_OUT Y_IN PB_IN
Table. 1. Pin assignment
REV. A
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Cautions on use (1) Absolute maximum ratings If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you think of a case in which absolute maximum ratings are exceeded, enforce fuses or other physical safety measures and investigate how not to apply the conditions under which absolute maximum ratings are exceeded to LSI. (2) VEE line Connect VEE_IN(B1) and VEE_OUT(A1) as shortly as possible on a board. (3) GND line Connect CP_GND(A3) and V_GND(C3) to board's GND layer with thick line as shortly as possible. When every GND line's common impedance becomes large, the noise characteristic sometimes deteriorates. (4) VCC line Short CP_VCC(B4) and V_VCC(C2) on the board, and supply voltage from the identical power. At the same time, place decoupling capacitor near the VCC pins. (5) Cross talk Board layout affects the cross talk. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (6) The noise characteristic of video signal Board layout affects the noise characteristic of video signal. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (7) Thermal design Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in actual states of use. (8) Shorts between pins and miss-installation When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is miss-installed and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and GND. (9) Operation in strong magnetic fields Adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction.
REV. A
Notice
Notes
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